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ISL24021
Data Sheet June 3, 2009 FN6637.0
1A Rail-to-Rail Input-Output Operational Amplifier
The ISL24021 is a high output current, high voltage, rail-to-rail voltage feedback amplifier. The ISL24021 is capable of 1A peak output short circuit current. The amplifier exhibits beyond the rail input capability, rail-to-rail output capability and is unity gain stable. The operating supply voltage range is from 4.5V to 19V maximum and the ISL24021 can be configured for single or dual supply operation. The ISL24021 has the ability to quickly source and sink large peak currents up to 1A and to drive large continuous currents of 300mA. The ISL24021 features fast slewing and settling times. Also, the device provides common mode input capability beyond the supply rails, and rail-to-rail output capability. This enables the amplifier to offer maximum dynamic range at any supply voltage. These features make the ISL24021 an ideal solution as a VCOM driver in TFT-LCD panel applications. Other applications may include battery power and portable devices, and especially where low power consumption is important. The ISL24021 is available in a 8 Ld 3mmx3mm TDFN package featuring a standard operational amplifier pinout with a lead pitch of 0.65mm. The device utilizes a thermally enhanced package and has a built-in thermal protection circuit. It is specified for operation over an ambient temperature range of -40C to +85C.
Features
* 1A Output Short Circuit Current * 4.5V to 19V Maximum Supply Voltage Range * 2.0mA Supply Current * 18V/s Slew Rate * 25MHz -3dB Bandwidth * 300mA Continuous Output Current * Unity-Gain Stable * Beyond the Rails Input Capability * Rail-to-Rail Output Swing * Built-in Thermal Protection * -40C to +85C Ambient Temperature Range * Pb-Free (RoHS Compliant)
Applications
* TFT-LCD Panels * VCOM Driver * Video Processing * Audio Processing * Active Filters * Test Equipment * Battery-Powered Applications
Pinout
ISL24021 (8 LD TDFN) TOP VIEW
NC 1 INN 2 INP 3 VSS 4 8 NC 7 VDD 6 OUT 5 NC
* Portable Equipment
Ordering Information
PART NUMBER (Note) ISL24021IRT065Z ISL24021IRT065Z-T13* LEAD PITCH PART PACKAGE PKG. (mm) MARKING (Pb-Free) DWG. # 0.65 0.65 P021 P021 8 Ld TDFN L8.3x3A 8 Ld TDFN L8.3x3A
THERMAL PAD
THERMAL PAD IS ELECTRICALLY ISOLATED, OR CONNECTED TO VSS
*Please refer to TB347 for details on reel specifications NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2009. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
ISL24021
Absolute Maximum Ratings (TA = +25C)
Supply Voltage Range (VDD -VSS) . . . . . . . . . . . . . . . . . . . . . 19.8V Input Voltage Range (INN, INP). . . . . . . . . . VSS - 0.5V, VDD + 0.5V Input Differential Voltage (INP - INN) . . . (VDD + 0.5V) - (VSS - 0.5V) ESD Rating Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3000V
Thermal Information
Thermal Resistance (Typical, Note 1) JA (C/W) 8 Ld TDFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65C to +150C Ambient Operating Temperature . . . . . . . . . . . . . . . .-40C to +85C Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . see Figure 28 Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty.
NOTE: 1. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. See Tech Brief TB379.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
PARAMETER
VDD = 5V, VSS = -5V, RL = 1k to 0V, TA = +25C, Unless Otherwise Specified. CONDITIONS MIN (Note 4) TYP MAX (Note 4) UNIT
DESCRIPTION
POWER SUPPLY PERFORMANCE VDD - VSS IS PSRR Supply Voltage Range Supply Current Power Supply Rejection Ratio No load VS is moved from 2.25V to 9.5V VCM = 0V VCM = 0V 60 4.5 2.1 80 19 2.8 V mA dB
INPUT CHARACTERISTICS VOS TCVOS ILEAK RIN CIN CMIR CMRR AVOL VOH VOL ISC IOUT SR tS BW PM Input Offset Voltage Average Offset Voltage Drift (Note 2) Input Leakage Current Input Resistance Input Capacitance Common-Mode Input Range Common-Mode Rejection Ratio Open-Loop Gain For VIN from -5.5V to 5.5V -4.5V VOUT 4.5V IL= 5mA, VIN = VDD IL= -5mA,VIN = VSS VSS0.5 50 75 70 100 1.4 1 2 1 2 VDD+ 0.5 10 15 mV V/C nA G pF V dB dB
OUTPUT CHARACTERISTICS Output Swing High Output Swing Low Short-Circuit Current Continuous Output Current (Note 6) -4.0V VOUT 4.0V AV = +1, VO = 2V step AV = +1, RL = 1k, CL= 8pF RL = 1k, CL= 8pF Die temperature at which the device will shutdown until it cools by TTSH C Die temperature below TTS C when the device will become operational after shutdown VDD0.15 VDD0.025 VSS+ 0.025 1.0 300 VSS+ 0.15 V V A mA
DYNAMIC PERFORMANCE Slew Rate (Note 3) Settling to 0.1% (Note 5) -3dB Bandwidth Phase Margin 18 80 25 44 V/s ns MHz
THERMAL PERFORMANCE TTS TTSH Thermal Shutdown Temperature Thermal Shutdown Hysteresis +165 15 C C
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ISL24021
.
Electrical Specifications
PARAMETER
VDD = 5V, VSS = GND = 0V, RL = 1k to 2.5V, TA = +25C, Unless Otherwise Specified. CONDITION MIN (Note 4) TYP MAX (Note 4) UNIT
DESCRIPTION
POWER SUPPLY PERFORMANCE VDD - VSS IS PSRR Supply Voltage Range Supply Current Power Supply Rejection Ratio No load VS is moved from +4.5V to +19V 60 4.5 2.0 80 19 2.8 V mA dB
INPUT CHARACTERISTICS VOS TCVOS ILEAK RIN CIN CMIR CMRR AVOL Input Offset Voltage Average Offset Voltage Drift (Note 2) Input Leakage Current Input Resistance Input Capacitance Common-Mode Input Range Common-Mode Rejection Ratio Open-Loop Gain For VIN from -0.5V to 5.5V 0.5V VOUT 4.5V VSS0.5 45 70 70 100 VCM = 2.5V VCM = 2.5V 1.4 1 2 1 2 VDD+ 0.5 10 15 mV V/C nA G pF V dB dB
OUTPUT CHARACTERISTICS VOH VOL ISC IOUT Output Swing High Output Swing Low Short-Circuit Current Continuous Output Current (Note 6) IL= 5mA, VIN = VDD IL= -5mA,VIN = VSS VDD0.15 VDD0.025 VSS+ 0.025 0.5 300 VSS+ 0.15 V V A mA
DYNAMIC PERFORMANCE SR tS BW PM Slew Rate (Note 3) Settling to 0.1% (Note 5) -3dB Bandwidth Phase Margin 1V VOUT 4V AV = +1, VO = 2V step AV = +1, RL = 1k, CL= 8pF RL = 1k, CL= 8pF 15 80 22 46 V/s ns MHz
THERMAL PERFORMANCE TTS TTSH Thermal Shutdown Temperature Thermal Shutdown Hysteresis Die temperature at which the device will shutdown until it cools by TTSH C Die temperature below TTS C when the device will become operational after shutdown +165 15 C C
Electrical Specifications
PARAMETER
VDD = 15V, VSS = GND = 0V, RL = 1k to 7.5V, TA = +25C, Unless Otherwise Specified. CONDITION MIN (Note 4) TYP MAX (Note 4) UNIT
DESCRIPTION
POWER SUPPLY PERFORMANCE VDD - VSS IS PSRR Supply Voltage Range Supply Current Power Supply Rejection Ratio No load VS is moved from +4.5V to +19V 60 4.5 2.2 80 19 2.8 V mA dB
INPUT CHARACTERISTICS VOS TCVOS Input Offset Voltage Average Offset Voltage Drift (Note 2) VCM = 7.5V 1.4 1 15 mV V/C
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ISL24021
Electrical Specifications
PARAMETER ILEAK RIN CIN CMIR CMRR AVOL VDD = 15V, VSS = GND = 0V, RL = 1k to 7.5V, TA = +25C, Unless Otherwise Specified. (Continued) CONDITION VCM = 7.5V MIN (Note 4) TYP 2 1 2 VSS0.5 For VIN from -0.5V to 15.5V 0.5V VOUT 14.5V 50 75 70 95 VDD+ 0.5 MAX (Note 4) 10 UNIT nA G pF V dB dB
DESCRIPTION Input Leakage Current Input Resistance Input Capacitance Common-Mode Input Range Common-Mode Rejection Ratio Open-Loop Gain
OUTPUT CHARACTERISTICS VOH Output Swing High IL= 100mA, VIN = VDD IL= 7.5mA, VIN = VDD VOL Output Swing Low IL= -100mA,VIN = VSS IL= -7.5mA,VIN = VSS ISC IOUT Short-Circuit Current Continuous Output Current (Note 6) VDD 0.15 VDD 0.4 VDD 0.025 VSS + 0.4 VSS + 0.025 1.0 300 VSS + 0.15 V V V V A mA
DYNAMIC PERFORMANCE SR tS BW PM Slew Rate (Note 3) Settling to 0.1% (Note 5) -3dB Bandwidth Phase Margin 1V VOUT 14V AV = +1, VO = 2V step AV = +1, RL = 1k, CL= 8pF RL = 1k, CL= 8pF 19 80 27 42 V/s ns MHz
THERMAL PERFORMANCE TTS TTSH Thermal Shutdown Temperature Thermal Shutdown Hysteresis Die temperature at which the device will shutdown until it cools by TTSH C Die temperature below TTS C when the device will become operational after shutdown +165 15 C C
NOTES: 2. Measured over the -40C to +85C ambient operating temperature range. 3. Typical slew rate is an average of the slew rates measured on the rising (20% to 80%) and the falling (80% to 20%) edges of the output signal. 4. Parameters with MIN and/or MAX limits are 100% tested at +25C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 5. Settling time measured from [Full Scale - (0.1%*StepSize)] on the rising edge to when the output is bounded within 0.1% of full scale. 6. Continuous output current with a typical of 300mA. Care should be taken to ensure the maximum package power dissipation is not exceeded, refer to "Power Dissipation" on page 10.
Pin Descriptions
PIN NUMBER 1, 5, 8 2 3 4 6 7 PIN NAME NC INN INP VSS OUT VDD Analog Input Analog Input Analog Power Analog Output Analog Power PIN TYPE No Connection Amplifier negative input Amplifier positive input Negative power supply (connect to GND for single supply operation) Amplifier output Positive power supply PIN FUNCTION
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ISL24021 Typical Performance Curves
500 450 NUMBER OF DEVICES 400 350 300 250 200 150 100 50 0 -6 -4 -2 0 2 4 6 INPUT OFFSET VOLTAGE (mV) VS = 5V TA = +25C TYPICAL PRODUCTION DISTRIBUTION 1.0 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 -50 0 50 TEMPERATURE (C) 100 150 VS = 5V
INPUT OFFSET VOLTAGE (mV)
FIGURE 1. INPUT OFFSET VOLTAGE DISTRIBUTION
FIGURE 2. INPUT OFFSET VOLTAGE vs TEMPERATURE
2.0 INPUT LEAKAGE CURRENT (nA) OUTPUT HIGH VOLTAGE (V) 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 -50 0 50 TEMPERATURE (C) 100 150 VS = 5V
4.972 4.970 4.968 4.966 4.964 4.962 4.960 -50 VS = 5V AV = 1 RL = 1k
0
50 TEMPERATURE (C)
100
150
FIGURE 3. INPUT LEAKAGE CURRENT vs TEMPERATURE
FIGURE 4. OUTPUT HIGH VOLTAGE vs TEMPERATURE
-4.980 OUTPUT LOW VOLTAGE (V) -4.982 -4.984 -4.986 -4.988 -4.990 -4.992 -50 VS = 5V AV = 1 RL = 1k
120 VS = 5V OPEN LOOP GAIN (dB) 0 50 TEMPERATURE (C) 100 150 110
100
90
80
70 -50
0
50 TEMPERATURE (C)
100
150
FIGURE 5. OUTPUT LOW VOLTAGE vs TEMPERATURE
FIGURE 6. OPEN-LOOP GAIN vs TEMPERATURE
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ISL24021 Typical Performance Curves (Continued)
100 VS = 5V 95 90 85 80 75 70 -50 0 50 TEMPERATURE (C) 100 150 90 CMRR (dB) 100 VS = 5V
PSRR (dB)
80
70
60
50 -50
0
50 TEMPERATURE (C)
100
150
FIGURE 7. PSRR vs TEMPERATURE
FIGURE 8. CMRR vs TEMPERATURE
22 SUPPLY CURRENT (mA) VS = 5V AV = 2 RL = 1k
2.6
VS = 5V AV = 1
SLEW RATE (V/s)
20
2.4
2.2
18
2.0
16
1.8
14 -50 0 50 TEMPERATURE (C) 100 150
1.6 -50
0
50 TEMPERATURE (C)
100
150
FIGURE 9. SLEW RATE vs TEMPERATURE
FIGURE 10. SUPPLY CURRENT vs TEMPERATURE
140 TA = +25C 120 GAIN (dB) SUPPLY CURRENT (mA)
4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 8 12 SUPPLY VOLTAGE (V) 16 20 4 8 12 SUPPLY VOLTAGE (V) 16 20 TA = +25C RL = OPEN CL = OPEN
100
80
60
40 4
FIGURE 11. OPEN-LOOP GAIN vs SUPPLY VOLTAGE
FIGURE 12. SUPPLY CURRENT vs SUPPLY VOLTAGE
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ISL24021 Typical Performance Curves (Continued)
5 V = 5V 4 AS = 1 V 3 CL = 1.5pF 2 GAIN (dB) 1 0 -1 -2 -3 -4 -5 100k 1M 10M FREQUENCY (Hz) 100M 150 560
10 8
1k GAIN (dB) VS = 5V AV = 1 RL = OPEN 47pF
6 4 2 0 -2 -4 -6 -8
100pF
10pF
-10 100k
1M 10M FREQUENCY (Hz)
100M
FIGURE 13. FREQUENCY RESPONSE FOR VARIOUS RL
FIGURE 14. FREQUENCY RESPONSE FOR VARIOUS CL
5 4 3 STEP SIZE (V) 2 1 0 -1 -2 -3 -4 -5 50 60 70 80 90 SETTLING TIME (ns) 100 110 0.1% VS = 5V AV = 1 RL = 1k
120 100 80 60 GAIN (dB) 40 20 0 -20 -40 -60 -80 10 VS = 5V TA = +25C 100 1k 10k 100k 1M 10M PHASE () GAIN (dB)
180 160 140 120 100 80 60 40 20 0 -20 100M PHASE()
FREQUENCY (Hz)
FIGURE 15. STEP SIZE vs SETTLING TIME
FIGURE 16. OPEN LOOP GAIN AND PHASE
-10 -20 -30 CMRR (dB) -40 -50 -60 -70 -80 -90 100 1k 10k 100k 1M 10M 100M VS = 5V RL = 1k TA = +25C PSRR (dB)
10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 100
VS = 5V RL = 1k TA = +25C
PSRR-
PSRR+ 1k 10k 100k 1M FREQUENCY (Hz) 10M 100M
FREQUENCY (Hz)
FIGURE 17. CMRR vs FREQUENCY
FIGURE 18. PSRR vs FREQUENCY
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ISL24021 Typical Performance Curves (Continued)
1000 VOLTAGE NOISE (nV/Hz)
VS = 5V AV = 1 RL = 1k
100
10 6V STEP 200ns/DIV
1 10 100 1k 10k 100k FREQUENCY (Hz) 1M 10M 100M
FIGURE 19. INPUT VOLTAGE NOISE SPECTRAL DENSITY
FIGURE 20. LARGE SIGNAL TRANSIENT RESPONSE
VS = 5V AV = 1 RL = 1k
INN INP ISL24021 0.1F 4.7F
VDD
200mV STEP 200ns/DIV
VSS 4.7F 0.1F THERMAL PAD CONNECTED TO VSS RL
OUT CL
FIGURE 21. SMALL SIGNAL TRANSIENT RESPONSE
FIGURE 22. TEST CIRCUIT
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FN6637.0 June 3, 2009
ISL24021 Applications Information
Product Description
The ISL24021 is a high output current, high voltage, rail-to-rail voltage feedback amplifier. The ISL24021 is capable of 1A peak output short circuit current. The amplifier exhibits beyond the rail input capability, rail-to-rail output capability and is unity gain stable. Other features include fast slew rate and settling time which is important in many applications, such as TFT-LCD panels. The ISL24021 is available in a 8 Ld 3mmx3mm TDFN package featuring a standard operational amplifier pinout and a lead pitch of 0.65mm. The device utilizes a thermally enhanced package and has a built-in thermal protection circuit. It is specified for operation over an ambient temperature range of -40C to +85C.
1V VS = 2.5V, TA = +25C, AV = 1, VIN = 6VP-P 1V 10s
FIGURE 23. OPERATION WITH BEYOND-THE-RAILS INPUT
.
VS = 5V, TA = +25C, AV = 1, VIN = 10VP-P 5V 10s
Operating Voltage, Input and Output Capability
The ISL24021 can operate on a single supply or dual supply configuration. The ISL24021 operating voltage ranges from a minimum of 4.5V to a maximum of 19V. This range allows for a standard 5V (or 2.5V) supply voltage to dip to -10%, or a standard 18V (or 9V) to rise by +5.5% without affecting performance or reliability. The input common mode voltage range extends 0.5V beyond the supply rails. For this range, the ISL24021 amplifier is immune to phase reversal. If the common mode input voltage exceeds the supply voltage by more than 0.5V, electrostatic protection diodes in the input stage of the device begin to conduct. It is suggested to not overdrive the inputs. Figure 23 shows the input voltage driven beyond the supply rails and the device output swinging between the supply rails. The output swings of the ISL24021 typically extend to within 25mV of positive and negative supply rails with load currents of 5mA. Decreasing load currents will extend the output voltage range even closer to the supply rails. Figure 24 shows the input and output waveforms for the device in a unity-gain configuration. Operation is from 5V supply with a 1k load connected to GND. The input is a 10VP-P sinusoid and the output voltage is approximately 9.95VP-P. Refer to the "Electrical Specifications" tables beginning on page 2 for specific device parameters. Parameter variations with operating voltage, loading and/or temperature are shown in the "Typical Performance Curves" on page 5.
5V
FIGURE 24. OPERATION WITH RAIL-TO-RAIL INPUT AND OUTPUT
Output Current Limit
The ISL24021 is capable of 1A peak output short circuit current. The device will limit the current to 1A. Maximum reliability is maintained if the output continuous current never exceeds 300mA. This limit is set by the characteristics of the internal metal interconnects. See "Power Dissipation" on page 10 for detailed information about ensuring device operation with temperature and load conditions.
Driving Capacitive Loads
As load capacitance increases, the -3dB bandwidth will decrease and peaking can occur. Depending on the application, it may be necessary to reduce peaking and to improve device stability. To improve device stability a snubber circuit or a series resistor may be added to the output of the ISL24021. A snubber is a shunt load consisting of a resistor in series with a capacitor, see Figure 25. An optimized snubber can improve the phase margin and the stability of the ISL24021. The advantage of a snubber circuit is that it does not draw any DC load current or reduce the gain. Another method to reduce peaking is to add a series output resistor (typically between 1 to 10; see Figure 26). Depending on the capacitive loading, a small value resistor may be the most appropriate choice to minimize any reduction in gain.
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OUTPUT
FN6637.0 June 3, 2009
INPUT
ISL24021
.
Power Dissipation
INN INP VDD
ISL24021
4.7F 0.1F OUT
VSS 4.7F 0.1F
RSNUBBER
With a 300mA maximum continuous output drive capability, it is possible to exceed the rated +150C maximum junction temperature. It is important to calculate the maximum power dissipation of the ISL24021 for the application. Proper load conditions will ensure that the ISL24021 junction temperature stays within a safe operating region. The ISL24021 has a built-in thermal protection, which automatically shuts the output OFF (high impedance) when the die temperature reaches +165C. This ensures safe operation and prevents internal damage to the device. When the die cools by +15C the output will automatically turn ON. The maximum power dissipation allowed in a package is determined according to Equation 1:
T JMAX - T AMAX P DMAX = ------------------------------------------- JA (EQ. 1)
ZL THERMAL PAD CONNECTED TO VSS CSNUBBER
FIGURE 25. OUTPUT SNUBBER CIRCUIT
.
INN INP
VDD
ISL24021
0.1F
4.7F
VSS RSERIES 4.7F 0.1F THERMAL PAD CONNECTED TO VSS
OUT ZL
where: * TJMAX = Maximum junction temperature * TAMAX = Maximum ambient temperature * JA = Thermal resistance of the package * PDMAX = Maximum power dissipation in the package The actual maximum power dissipation of the IC is the total quiescent supply current, times the total power supply voltage, plus the power dissipation in the IC caused by the loading condition. Sourcing:
P DMAX = V S x I S + [ V DD - V OUT ) x I LOAD ] (EQ. 2)
FIGURE 26. OUTPUT SERIES RESISTOR CIRCUIT
Typical Application Circuit
A typical application of the ISL24021 is as a TFT-LCD VCOM driver (see Figure 27). A VCOM driver maintains the backplane common voltage of a TFT-LCD panel. Maintaining the VCOM voltage at a steady level is critical to panel performance. The ability of the ISL24021 to source/sink large peak short circuit currents make it ideal as a VCOM driver. The 1A short circuit current capability combined with a large bandwidth and fast settling time give the ISL24021 ideal VCOM driver characteristics, and make it a great choice for TFT-LCD applications.
VDD = 15V VCOM CALIBRATOR / RESISTOR LADDER ISL24021 INN INP + OUT VSS THERMAL PAD CONNECTED TO VSS TFT-LCD 0.1F 4.7F
Sinking:
P DMAX = V S x I S + [ V OUT - V SS ) x I LOAD ] (EQ. 3)
* VS = Total supply voltage range (VDD - VSS) * IS = Device supply current * VDD = Positive supply voltage * VSS = Negative supply voltage * VOUT = Output voltage * ILOAD = Load current Device overheating can be avoided by calculating the minimum resistive load condition, RLOAD, resulting in the highest power dissipation. To find RLOAD, set the two PDMAX equations equal to each other and solve for VOUT/ILOAD. Reference the package power dissipation curve, Figure 28, for further information.
0.1F
+ CSTORAGE
PANEL CAPACITANCE
NOTE: CSTORAGE WILL VARY DEPENDING ON THE APPLICATION
FIGURE 27. TYPICAL APPLICATION CIRCUIT: TFT-LCD VCOM
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FN6637.0 June 3, 2009
ISL24021
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY (4-LAYER) TEST BOARD TDFN EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 3.0 2.5W POWER DISSIPATION (W) 2.5 2.0 1.5 1.0 0.5 0 0 25 50 75 100 125 150 AMBIENT TEMP (C) TDFN8 JA = +50 (C/W)
Printed Circuit Board Layout
As with any high-frequency device, good printed circuit board layout is necessary for optimum performance. For the ISL24021 low impedance analog power and ground planes are recommended, and trace lengths should be as short as possible. The power supply pins must be well bypassed to reduce the risk of oscillation. For optimal thermal and operating performance the ISL24021 thermal pad should always be connected to the lowest potential, VSS. For normal single supply operation (the VSS pin is connected to GND) a 4.7F capacitor should be placed from VDD to GND, then a parallel 0.1F capacitor should be connected as close to the amplifier as possible. For dual supply operation the same bypassing techniques should be utilized by connecting capacitors from each supply to GND.
FIGURE 28. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
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FN6637.0 June 3, 2009
ISL24021 Thin Dual Flat No-Lead Plastic Package (TDFN)
2X 0.15 C A A D 2X 0.15 C B
L8.3x3A
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS SYMBOL A A1 MIN 0.70 NOMINAL 0.75 0.02 0.20 REF 0.25 0.30 3.00 BSC 2.20 2.30 3.00 BSC 1.40 1.50 0.65 BSC 0.25 0.20 0.30 8 4 0.40 1.60 2.40 0.35 MAX 0.80 0.05 NOTES 5, 8 7, 8, 9 7, 8, 9 8 2 3 Rev. 3 11/04 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals.
E 6 INDEX AREA TOP VIEW B
A3 b D D2 E
// 0.10 C 0.08 C
E2 e k L N Nd
A C SEATING PLANE
SIDE VIEW
A3
D2 (DATUM B) 1 2 D2/2
7
8
6 INDEX AREA (DATUM A)
NX k E2 E2/2
3. Nd refers to the number of terminals on D. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance.
NX L N 8 N-1 e 5 (Nd-1)Xe REF. BOTTOM VIEW C L NX (b) 5 SECTION "C-C" TERMINAL TIP FOR EVEN TERMINAL/SIDE e (A1) L1 10 L 0.10 M C A B NX b
8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. 9. Compliant to JEDEC MO-WEEC-2 except for the "L" min dimension.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 12
FN6637.0 June 3, 2009

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